- UCC27324DR
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- 发布者:凌晔科技
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详细信息
品牌:TI德州
封装:SOP8
批号:18+
数量*:18700000
描述:UCC27524A - 器件与被比较器件具有相同的功能和引脚排列,但并不完全等效。 Next Generation 5A High Speed Low-Side Gate Driver
UCC27324
The UCC2732x and UCC3732x family of high-speed dual-MOSFET Drivers deliver large peak currents into capacitive loads. Three standard logic options are offered – dual-inverting, dual-noninverting, and one-inverting and one-noninverting driver. The thermally enhanced 8-pin PowerPAD MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. UCC2732x and UCC3732x is also offered in the standard SOIC-8 (D) or PDIP-8 (P) packages.
Using a design that inherently minimizes shoot-through current, these drivers deliver 4 A of current where it is needed most at the Miller plateau region during the MOSFET switching transition. A unique BiPolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.
产品特性
Industry-Standard Pin-Out
High Current-Drive Capability of ±4 A at the Miller Plateau Region
Efficient Constant-Current Sourcing Even at Low Supply Voltages
TTL/CMOS Compatible Inputs Independent of Supply Voltage
20-ns Typical Rise and 15-ns Typical Fall Times with 1.8-nF Load
Typical Propagation-Delay Times of 25 ns with Input Falling and 35 ns with Input Rising
4.5-V to 15-V Supply Voltage
Supply Current of 0.3 mA
Dual Outputs are Paralleled for Higher Drive Current
Available in Thermally Enhanced MSOP-PowerPAD™ Package
Rated From –40°C to +125°C
TrueDrive™ Output Architecture Using Bipolar and CMOS Transistors in Parallel
深圳市凌晔科技有限公司
广东省深圳市福田区华强广场C座13L
Tel:13544017528
qq:869030400
E-mail:869030400@qq.com
封装:SOP8
批号:18+
数量*:18700000
描述:UCC27524A - 器件与被比较器件具有相同的功能和引脚排列,但并不完全等效。 Next Generation 5A High Speed Low-Side Gate Driver
UCC27324
The UCC2732x and UCC3732x family of high-speed dual-MOSFET Drivers deliver large peak currents into capacitive loads. Three standard logic options are offered – dual-inverting, dual-noninverting, and one-inverting and one-noninverting driver. The thermally enhanced 8-pin PowerPAD MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. UCC2732x and UCC3732x is also offered in the standard SOIC-8 (D) or PDIP-8 (P) packages.
Using a design that inherently minimizes shoot-through current, these drivers deliver 4 A of current where it is needed most at the Miller plateau region during the MOSFET switching transition. A unique BiPolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.
产品特性
Industry-Standard Pin-Out
High Current-Drive Capability of ±4 A at the Miller Plateau Region
Efficient Constant-Current Sourcing Even at Low Supply Voltages
TTL/CMOS Compatible Inputs Independent of Supply Voltage
20-ns Typical Rise and 15-ns Typical Fall Times with 1.8-nF Load
Typical Propagation-Delay Times of 25 ns with Input Falling and 35 ns with Input Rising
4.5-V to 15-V Supply Voltage
Supply Current of 0.3 mA
Dual Outputs are Paralleled for Higher Drive Current
Available in Thermally Enhanced MSOP-PowerPAD™ Package
Rated From –40°C to +125°C
TrueDrive™ Output Architecture Using Bipolar and CMOS Transistors in Parallel
深圳市凌晔科技有限公司
广东省深圳市福田区华强广场C座13L
Tel:13544017528
qq:869030400
E-mail:869030400@qq.com
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